FG000626

 Hodgson Sealants HY-SPEC 25 is a single-component, solvent-free, neutral cure sealant. It utilizes moisture curing and belongs to the low modulus hybrid category, formulated with Hodgson Hybrid Polymer Technology. Free of solvents and isocyanates. Offers outstanding tooling capabilities. Minimal odor, ensuring user-friendliness. Possesses high strength and maintains permanent flexibility. Accommodates significant movement effectively. Applicable within a temperature range of +5 to +40°C. Demonstrates excellent primerless adhesion to a wide range of s